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drv8821 www.ti.com slvs912c ? january 2009 ? revised january 2010 dual stepper motor controller/driver check for samples: drv8821 1 features ? simple step/direction interface 2 ? dual pwm microstepping motor driver ? fully protected against undervoltage, overtemperature, and overcurrent ? built-in microstepping indexers ? thermally enhanced surface mount package ? up to 1.5-a current per winding ? three-bit winding current control allows applications up to eight current levels ? printers ? low mosfet on-resistance ? scanners ? selectable slow or mixed decay modes ? office automation machines ? 8-v to 32-v operating supply voltage range ? gaming machines ? internal charge pump for gate drive ? factory automation ? built-in 3.3-v reference ? robotics description/ordering information the drv8821 provides a dual microstepping-capable stepper motor controller/driver solution for printers, scanners, and other office automation equipment applications. two independent stepper motor driver circuits include four h-bridge drivers and microstepping-capable indexer logic. each of the motor driver blocks employ n-channel power mosfets configured as an h-bridge to drive the motor windings. a simple step/direction interface allows easy interfacing to controller circuits. pins allow configuration of the motor in full-step, half-step, quarter-step, or eighth step modes, and the selection of slow or mixed decay modes. internal shutdown functions are provided for over current protection, short circuit protection, under voltage lockout and overtemperature. the drv8821 is packaged in a 48-pin htssop package (eco-friendly : rohs & no sb/br). ordering information (1) t a package (2) orderable part number top-side marking reel of 2000 DRV8821DCAr ? 40 c to 85 c powerpad ? (htssop) - dca drv8821 tube of 40 DRV8821DCA (1) for the most current package and ordering information, see the package option addendum at the end of this document, or see the ti web site at www.ti.com . (2) package drawings, thermal data, and symbolization are available at www.ti.com/packaging . 1 please be aware that an important notice concerning availability, standard warranty, and use in critical applications of texas instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. 2 powerpad, powerpad are trademarks of texas instruments. production data information is current as of publication date. copyright ? 2009 ? 2010, texas instruments incorporated products conform to specifications per the terms of the texas instruments standard warranty. production processing does not necessarily include testing of all parameters.
drv8821 slvs912c ? january 2009 ? revised january 2010 www.ti.com functional block diagram 2 submit documentation feedback copyright ? 2009 ? 2010, texas instruments incorporated product folder link(s): drv8821 charge pump and gate drive regulator thermal shut down aout1 aout2 bout1 bout2 gnd abvref 0.1f 16v 0.01f 35v +24 step motor vm cp1 cp2 vcp aisen bisen vcp +24 ocp vm +24 oscillator cout1 cout2 dout1 dout2 step motor vm cisen disen vm +24 +24 uvlo reset vgd abstep abdir abenbln abusm0 abusm1 dig. vcc v3p3 3.3v regulator 0.47f 6.3v cdvref pwm h-bridge driver a pwm h-bridge driver b pwm h-bridge driver c pwm h-bridge driver d indexer logic abdecay cdstep cddir cdenbln cdusm0 cdusm1 cddecay abresetn cdresetn
drv8821 www.ti.com slvs912c ? january 2009 ? revised january 2010 terminal functions name no. i/o (1) description external components or connections power and ground vm 1,2, connect all vm pins together to motor supply voltage. - motor supply voltage (multiple pins) (4 pins) 23, 24 bypass to gnd with several 0.1- m f, 35-v ceramic capacitors. v3p3 16 - 3.3 v regulator output bypass to gnd with 0.47- m f, 6.3-v ceramic capacitor. gnd 10-15, - power ground (multiple pins) connect all pgnd pins to gnd and solder to copper heatsink areas. 34-39 cp1 7 io charge pump flying capacitor connect a 0.01- m f capacitor between cp1 and cp2 cp2 8 io vcp 9 io charge pump storage capacitor connect a 0.1- m f, 16 v ceramic capacitor to v m motor ab abstep 45 i motor ab step input rising edge causes the indexer to move one step. abdir 43 i motor ab direction input level sets the direction of stepping. abusm0 44 i motor ab microstep mode 0 usm0 and usm1 set the step mode - full step, half step, quarter step, or eight microsteps/step. abusm1 41 i motor ab microstep mode 1 abenbln 42 i motor ab enable input logic high to disable motor a outputs, logic low to enable. active-low reset input initializes the indexer logic and disables the abresetn 40 i motor ab reset input h-bridge outputs for motor a. abdecay 6 i motor ab decay mode logic low for slow decay mode, high for mixed decay. motor ab current set reference abvref 17 i sets current trip threshold. voltage aout1 5 o bridge a output 1 connect to first coil of bipolar stepper motor 1, or dc motor winding. aout2 3 o bridge a output 2 aisen 4 - bridge a current sense connect to current sense resistor for bridge a. bout1 48 o bridge b output 1 connect to second coil of bipolar stepper motor 1, or dc motor winding. bout2 46 o bridge b output 2 bisen 45 - bridge b current sense connect to current sense resistor for bridge b. motor cd cdstep 33 i motor cd step input rising edge causes the indexer to move one step. cddir 31 i motor cd direction input level sets the direction of stepping. cdusm0 32 i motor cd microstep mode 0 usm0 and usm1 set the step mode - full step, half step, quarter step, or eight microsteps/step. cdusm1 29 i motor cd microstep mode 1 cdenbln 30 i motor cd enable input logic high to disable motor boutputs, logic low to enable. active-low reset input initializes the indexer logic and disables the cdresetn 28 i motor cd reset input h-bridge outputs for motor b. cddecay 19 i motor cd decay mode logic low for slow decay mode, high for mixed decay. motor cd current set reference cdref 18 i sets current trip threshold. voltage cout1 27 o bridge c output 1 connect to first coil of bipolar stepper motor 2, or dc motor winding. cout2 25 o bridge c output 2 cisen 26 - bridge c current sense connect to current sense resistor for bridge c. dout1 22 o bridge d output 1 connect to second coil of bipolar stepper motor 2, or dc motor winding. dout2 20 o bridge d output 2 disen 21 - bridge d current sense connect to current sense resistor for bridge d. (1) directions: i = input, o = output, oz = 3-state output, od = open-drain output, io = input/output copyright ? 2009 ? 2010, texas instruments incorporated submit documentation feedback 3 product folder link(s): drv8821
drv8821 slvs912c ? january 2009 ? revised january 2010 www.ti.com dca package absolute maximum ratings (1) (2) over operating free-air temperature range (unless otherwise noted) v m power supply voltage range ? 0.3 to 34 v v i logic input voltage range (3) ? 0.5 to 5.75 v i o(peak) peak motor drive output current, t < 1 m s internally limited i o motor drive output current (4) 1.5 a p d continuous total power dissipation see dissipation ratings table t j operating virtual junction temperature range ? 40 to 150 c t a operating ambient temperature range ? 40 to 85 c t stg storage temperature range ? 60 to 150 c (1) stresses beyond those listed under " absolute maximum ratings " may cause permanent damage to the device. these are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under " recommended operating conditions " is not implied. exposure to absolute ? maximum ? rated conditions for extended periods may affect device reliability. (2) all voltage values are with respect to network ground terminal. (3) input pins may be driven in this voltage range regardless of presence or absence of v m . (4) power dissipation and thermal limits must be observed. dissipation ratings derating factor board package r q ja t a < 25 c t a = 70 c t a = 85 c above t a = 25 c low-k (1) 75.7 c/w 13.2 mw/ c 1.65 w 1.06 w 0.86 w low-k (2) 32 c/w 31.3 mw/ c 3.91 w 2.50 w 2.03 w dca high-k (3) 30.3 c/w 33 mw/ c 4.13 w 2.48 w 2.15 w high-k (4) 22.3 c/w 44.8 mw/ c 5.61 w 3.59 w 2.91 w (1) the jedec low-k board used to derive this data was a 76-mm x 114-mm, 2-layer, 1.6-mm thick pcb with no backside copper. (2) the jedec low-k board used to derive this data was a 76-mm x 114-mm, 2-layer, 1.6-mm thick pcb with 25-cm 2 2-oz copper on back side. (3) the jedec high-k board used to derive this data was a 76-mm x 114-mm, 4-layer, 1.6-mm thick pcb with no backside copper and solid 1-oz internal ground plane. (4) the jedec high-k board used to derive this data was a 76-mm x 114-mm, 4-layer, 1.6-mm thick pcb with 25-cm 2 1-oz copper on back side and solid 1-oz internal ground plane. 4 submit documentation feedback copyright ? 2009 ? 2010, texas instruments incorporated product folder link(s): drv8821 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 28 27 26 25 24 23 22 21 20 abdecay aout1 vm vm aout2 aisen abstep abusm0 abdir abvref bisen cdvref cddecay abenbln v3p3 bout2 bout1 cdstep cdusm0 cddir cdenbln 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 pgnd pgnd pgnd pgnd pgnd pgnd solder these pins to copper heatsink area pgnd pgnd pgnd pgnd pgnd vcp cp2 cp1 vm dout2 disen dout1 vm abusm1 abresetn cisen cout2 cdresetn cout1 cdusm1 pgnd solder these pins to copper heatsink area
drv8821 www.ti.com slvs912c ? january 2009 ? revised january 2010 recommended operating conditions over operating free-air temperature range (unless otherwise noted) min nom max unit v m motor power supply voltage range 8 32 v i mot continuous motor drive output current (1) 1 1.5 a v ref vref input voltage 1 4 v (1) power dissipation and thermal limits must be observed. electrical characteristics over operating free-air temperature range (unless otherwise noted) parameter test conditions min typ max unit power supplies i vm v m operating supply current v m = 24 v, no loads 5 8 ma i vmsd v m shutdown supply current v m = 24 v, abenbln = cdenbln = 1 2.5 m a v uvlo v m undervoltage lockout voltage v m rising 6.5 8 v v cp charge pump voltage relative to v m 12 v v v3p3 v v3p3 output voltage 3.20 3.30 3.40 v logic-level inputs v il input low voltage 0.7 v v ih input high voltage 2 v v hys input hysteresis 0.3 0.45 0.6 v input current i in vin = 3.3 v 100 m a (internal pulldown current) overtemperature protection t tsd thermal shutdown temperature die temperature 150 c motor driver v m = 24 v, i o = 0.8 a, t j = 25 c 0.25 motor #1 fet on resistance r ds(on) ? (each individual fet) v m = 24 v, i o = 0.8 a, t j = 85 c 0.31 0.37 v m = 24 v, i o = 0.8 a, t j = 25 c 0.30 motor #2 fet on resistance r ds(on) ? (each individual fet) v m = 24 v, i o = 0.8 a, t j = 85 c 0.38 0.45 i off off-state leakage current 12 m a f pwm motor pwm frequency (1) 45 50 55 khz t blank itrip blanking time (2) 3.75 m s t f output fall time 50 300 ns t r output rise time 50 300 ns i ocp overcurrent protect level 1.5 3 4.5 a t ocp overcurrent protect trip time 2.5 m s t md mixed decay percentage measured from beginning of pwm cycle 75 % vref input/current control accuracy i ref xvref input current xvref = 3.3 v ? 3 3 m a xvref = 2.5 v, derived from v3p3; ? 5 5 % 71% to 100% current i chop chopping current accuracy xvref = 2.5 v, derived from v3p3; ? 10 10 % 20% to 56% current (1) factory option 100 khz. (2) factory options for 2.5 m s, 5 m s or 6.25 m s. copyright ? 2009 ? 2010, texas instruments incorporated submit documentation feedback 5 product folder link(s): drv8821
drv8821 slvs912c ? january 2009 ? revised january 2010 www.ti.com timing requirements over operating free-air temperature range (unless otherwise noted) min max unit 1 f step step frequency 200 khz 2 t wh(step) pulse duration, xstep high 2.5 m s 3 t wl(step) pulse duration, xstep low 2.5 m s 4 t su(step) setup time, command to xstep rising 200 ns 5 t h(step) hold time, command to xstep rising 200 ns 6 t wake wakeup time, sleepn inactive to xstep 1 ms 6 submit documentation feedback copyright ? 2009 ? 2010, texas instruments incorporated product folder link(s): drv8821 xstep xdir, xusmx 2 3 1 4 5 abenbln & cdenbln 6
drv8821 www.ti.com slvs912c ? january 2009 ? revised january 2010 functional description pwm motor drivers the drv8821 contains four h-bridge motor drivers with current-control pwm circuitry. a block diagram showing drivers a and b of the motor control circuitry (as typically used to drive a bipolar stepper motor) is shown below. drivers c and d are the same as a and b (though the r ds(on) of the output fets is different). figure 1. block diagram note that there are multiple vm motor power supply pins. all vm pins must be connected together to the motor supply voltage. copyright ? 2009 ? 2010, texas instruments incorporated submit documentation feedback 7 product folder link(s): drv8821 a ou t1 a ou t2 bou t1 b ou t2 step motor vm vm a is en b isen aph a se pre- drive pre- drive vc p, vgd vm vm + - pw m v cp, vgd + - pw m a bvr ef oc p oc p oc p oc p a bd ec a y b en bl dac dac a = 5 a = 5 a i[2:0] b i[2:0] 3 3 aen b l bph a se a i[2:0] 3 from indexer logic
drv8821 slvs912c ? january 2009 ? revised january 2010 www.ti.com current regulation the pwm chopping current is set by a comparator which compares the voltage across a current sense resistor connected to the xisen pins, multiplied by a factor of 5, with a reference voltage. the reference voltage is input from the xvref pin. the full-scale (100%) chopping current is calculated as follows: (1) example: if a 0.22- ? sense resistor is used and the vrefx pin is 3.3 v, the full-scale (100%) chopping current is 3.3 v/(5 * 0.22 ? ) = 1.875 a. the reference voltage is also scaled by an internal dac that allows torque control for fractional stepping of a bipolar stepper motor, as described in the " microstepping indexer " section below. decay mode during pwm current chopping, the h-bridge is enabled to drive through the motor winding until the pwm current chopping threshold is reached. this is shown in figure 2 as case 1. the current flow direction shown indicates positive current flow in the step table below. once the chopping current threshold is reached, the h-bridge can operate in two different states, fast decay or slow decay. in fast decay mode, once the pwm chopping current level has been reached, the h-bridge reverses state to allow winding current to flow in a reverse direction. as the winding current approaches zero, the bridge is disabled to prevent any reverse current flow. fast-decay mode is shown in figure 2 as case 2. in slow-decay mode, winding current is re-circulated by enabling both of the low-side fets in the bridge. this is shown in figure 2 as case 3. figure 2. decay mode 8 submit documentation feedback copyright ? 2009 ? 2010, texas instruments incorporated product folder link(s): drv8821 5 xout1 xout2 3 1 2 3 drive current slow decay (brake) fast decay (reverse) vm 1 2
drv8821 www.ti.com slvs912c ? january 2009 ? revised january 2010 the drv8821 also supports a mixed decay mode. mixed decay mode begins as fast decay, but after a period of time (75% of the pwm cycle) switches to slow decay mode for the remainder of the fixed pwm period. mixed decay mode is only active if the current through the winding is decreasing (per the indexer step table); if the current is increasing, then slow decay is always used. slow or mixed decay mode is selected by the state of the xdecay pins - logic low selects slow decay, and logic high selects mixed decay operation. blanking time after the current is enabled in an h-bridge, the voltage on the xisen pin is ignored for a fixed period of time before enabling the current sense circuitry. this blanking time is fixed at 3.75 m s. note that the blanking time also sets the minimum on time of the pwm. microstepping indexer built-in indexer logic in the drv8821 allows a number of different stepping configurations. the xusm1 and xusm0 pins are used to configure the stepping format as shown in the table below: xusm1 xusm0 step mode 0 0 full step (2-phase excitation) 0 1 ? step (1-2 phase excitation) 1 0 1/4 step (w1-2 phase excitation) 1 1 eight microsteps/steps the following table shows the relative current and step directions for different settings of xusm1 and xusm0. at each rising edge of the xstep input, the indexer travels to the next state in the table. the direction is shown with the dir pin high; if the xdir pin is low the sequence is reversed. positive current is defined as xout1 = positive with respect to xout2. note that the home state is 45 degrees. this state is entered at power-up or application of xresetn. motor ab and motor cd act independently, and their indexer logic functions identically. copyright ? 2009 ? 2010, texas instruments incorporated submit documentation feedback 9 product folder link(s): drv8821
drv8821 slvs912c ? january 2009 ? revised january 2010 www.ti.com aoutx boutx full step ? step 1/4 step 1/8 step step angle current current xusm = 00 xusm = 01 xusm = 10 xusm = 11 (degrees) (% full-scale) (% full-scale) 1 1 1 100 0 0 2 98 20 11.25 2 3 92 38 22.5 4 83 56 33.75 1 2 3 5 71 71 45 (home state) 6 56 83 56.25 4 7 38 92 67.5 8 20 98 78.75 3 5 9 0 100 90 10 ? 20 98 101.25 6 11 ? 38 92 112.5 12 ? 56 83 123.75 2 4 7 13 ? 71 71 135 14 ? 83 56 146.25 8 15 ? 92 38 157.5 16 ? 98 20 168.75 5 9 17 ? 100 0 180 18 ? 98 ? 20 191.25 10 19 ? 92 ? 38 202.5 20 ? 83 ? 56 213.75 3 6 11 21 ? 71 ? 71 225 22 ? 56 ? 83 236.25 12 23 ? 38 ? 92 247.5 24 ? 20 ? 98 258.75 7 13 25 0 ? 100 270 26 20 ? 98 281.25 14 27 38 ? 92 292.5 28 56 ? 83 303.75 4 8 15 29 71 ? 71 315 30 83 ? 56 326.25 16 31 92 ? 38 337.5 32 98 ? 20 348.75 xresetn and xenbln operation the xresetn pin, when driven active low, resets the step table to the home position. it also disables the h-bridge drivers. the xstep input is ignored while xresetn is active. note that there is a separate xresetn pin for each motor; each acts only on one of the two motor controllers. the xenablen pin is used to control the output drivers. when xenbln is low, the output h-bridges are enabled. when xenbln is high, the h-bridges are disabled and the outputs are in a high-impedance state.. note that there is a separate xenbln pin for each motor; each acts only on one of the two motor drivers. note that when xenbln is high, the input pins and control logic, including the indexer (xstep and xdir pins) are still functional. driving both abenbln and cdenbln high will put the device into a low power sleep state. in this state, the h-bridges are disabled, the gate drive charge pump is stopped, and all internal clocks are stopped. in this state all inputs are ignored until one or both of the xenbln pits return active low. 10 submit documentation feedback copyright ? 2009 ? 2010, texas instruments incorporated product folder link(s): drv8821
drv8821 www.ti.com slvs912c ? january 2009 ? revised january 2010 protection circuits the drv8821 is fully protected against undervoltage, overcurrent and overtemperature events. overcurrent protection (ocp) all of the drivers in drv8821 are protected with an ocp (over-current protection) circuit. the ocp circuit includes an analog current limit circuit, which acts by removing the gate drive form each output fet if the current through it exceeds a preset level. this circuit will limit the current to a level that is safe to prevent damage to the fet. a digital circuit monitors the analog current limit circuits. if any analog current limit condition exists for longer than a preset period, all drivers in the device will be disabled. the device is re-enabled upon the removal and re-application of power at the vm pins. thermal shutdown (tsd) if the die temperature exceeds safe limits, all drivers in the device will be shut down. the device will remain disabled until the die temperature has fallen to a safe level. after the temperature has fallen, the device may be re-enabled upon the removal and re-application of power at the vm pin. undervoltage lockout (uvlo) if at any time the voltage on the vm pins falls below the undervoltage lockout threshold voltage, all circuitry in the device will be disabled. operation will resume when vm rises above the uvlo threshold. the indexer logic will be reset to its initial condition in the event of an undervoltage lockout. shoot-through current prevention the gate drive to each fet in the h-bridge is controlled to prevent any cross-conduction (shoot through current) during transitions. copyright ? 2009 ? 2010, texas instruments incorporated submit documentation feedback 11 product folder link(s): drv8821
drv8821 slvs912c ? january 2009 ? revised january 2010 www.ti.com thermal information thermal protection the drv8821 has thermal shutdown (tsd) as described above. if the die temperature exceeds approximately 150 c, the device will be disabled until the temperature drops to a safe level. any tendency of the device to enter thermal shutdown is an indication of either excessive power dissipation, insufficient heatsinking, or too high an ambient temperature. power dissipation power dissipation in the drv8821 is dominated by the power dissipated in the output fet resistance, or r ds(on) . average power dissipation when running a stepper motor can be roughly estimated by equation 2 . (2) where p tot is the total power dissipation, r ds(on) is the resistance of each fet, and i out(rms) is the rms output current being applied to each winding. i out(rms) is equal to the approximately 0.7x the full-scale output current setting. the factor of 4 comes from the fact that there are two motor windings, and at any instant two fets are conducting winding current for each winding (one high-side and one low-side). remember that the drv8821 has two stepper motor drivers, so the power dissipation of each must be added together to determine the total device power dissipation. the maximum amount of power that can be dissipated in the drv8821 is dependent on ambient temperature and heatsinking. the thermal dissipation ratings table in the datasheet can be used to estimate the temperature rise for typical pcb constructions. note that r ds(on) increases with temperature, so as the device heats, the power dissipation increases. this must be taken into consideration when sizing the heatsink. heatsinking the powerpad ? package uses an exposed pad to remove heat from the device. for proper operation, this pad must be thermally connected to copper on the pcb to dissipate heat. on a multi-layer pcb with a ground plane, this can be accomplished by adding a number of vias to connect the thermal pad to the ground plane. on pcbs without internal planes, copper area can be added on either side of the pcb to dissipate heat. if the copper area is on the opposite side of the pcb from the device, thermal vias are used to transfer the heat between top and bottom layers. for details about how to design the pcb, refer to ti application report slma002 , " powerpad ? thermally enhanced package " and ti application brief slma004 , " powerpad ? made easy " , available at www.ti.com . in general, the more copper area that can be provided, the more power can be dissipated. figure 3 shows thermal resistance vs. copper plane area for both a single-sided pcb with 2-oz copper heatsink area, and a 4-layer pcb with 1-oz copper and a solid ground plane. both pcbs are 76 mm x 114 mm, and 1.6 mm thick. it can be seen that the heatsink effectiveness increases rapidly to about 20 cm 2 , then levels off somewhat for larger areas. six pins on the center of each side of the package are also connected to the device ground. a copper area can be used on the pcb that connects to the powerpad ? as well as to all the ground pins on each side of the device. this is especially useful for single-layer pcb designs. 12 submit documentation feedback copyright ? 2009 ? 2010, texas instruments incorporated product folder link(s): drv8821 p = r (i ) tot ds(on) out(rms) 4 2
drv8821 www.ti.com slvs912c ? january 2009 ? revised january 2010 figure 3. thermal resistance vs. copper plane area copyright ? 2009 ? 2010, texas instruments incorporated submit documentation feedback 13 product folder link(s): drv8821 20 25 30 35 40 45 50 55 60 65 70 0 10 20 30 40 50 60 70 80 90 backside copper area - cm 2 thermal resistance (r ) - c/w q ja low-k pcb (2 layer) high-k pcb (4 layer with ground plane)

packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish msl peak temp (3) DRV8821DCA active htssop dca 48 40 green (rohs & no sb/br) cu nipdau level-3-260c-168 hr DRV8821DCAr active htssop dca 48 2000 green (rohs & no sb/br) cu nipdau level-3-260c-168 hr (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. -- the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti to customer on an annual basis. package option addendum www.ti.com 23-jan-2010 addendum-page 1
tape and reel information *all dimensions are nominal device package type package drawing pins spq reel diameter (mm) reel width w1 (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant DRV8821DCAr htssop dca 48 2000 330.0 24.4 8.6 15.8 1.8 12.0 24.0 q1 package materials information www.ti.com 22-jan-2010 pack materials-page 1
*all dimensions are nominal device package type package drawing pins spq length (mm) width (mm) height (mm) DRV8821DCAr htssop dca 48 2000 346.0 346.0 41.0 package materials information www.ti.com 22-jan-2010 pack materials-page 2

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